This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.

本研究的目的是评估单晶铜引线接合的接合性和可靠性。

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In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.

本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。

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Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.

介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。

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