JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.
本文介绍了国内无氰镀银研究情况，部分翻译了日本专利特开2000-192279，介绍银及其合金的无氰电镀液组分及工艺，镀液比较稳定。
The progress in the study of cyanide-free copper electroplating on steel matrix is introduced according to different valences of copper in the deposition process.
按照沉积过程中铜的价态的不同对在钢铁基体上无氰碱性镀铜的研究进展进行了说明。
The process of cyanide-free silver pulse electroplating is investigated in 5,5-dimethyl hydantoin(DMH) bath.
研究了5，5-二甲基乙内酰脲（DMH）无氰脉冲镀银工艺。
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