针脚式封装有双列直插封装(Dual In-line Package),简称DIP 封装,DIP8 就是双排,每排有4 个引 脚,两排间距离是300mil,焊盘间的距离是100mil。SIPxx 就是单排的封装。
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它可能是连接器,双排包装(DIP, dual in-line package)的开关,发光二极管(LED, light emitting diode),或甚至是基板材料或锡膏.
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The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering.
加速度计的敏感元及测量专用芯片(ASIC) 集成在DIL 塑料封装内,其引脚可用于表面安装和回流焊接。
The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.
该器件提供两种封装:24引脚、0.3英寸宽、塑料密封双列直插式封装(DIP)和24引脚小形集成封装(SOIC)。
The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."
该器件提供两种封装:8引脚、0.3英寸宽、小型塑料或密封双列直插式封装(小型DIP);以及8引脚小形集成封装(SOIC)。
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