Electrodeposited copper foil have been mostly applied to PCBs. Along with development of electron trade, requiement increasing and demand of performance becoming higher.
电解铜箔主要应用于PCB电路板,随着电子行业的发展,需求量日益增多,性能要求也越来越高,超薄、低轮廓铜箔具有广阔的发展前景。
参考来源 - 电解铜箔工艺条件及其添加剂的实验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
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