电解铜箔 ( Electrodeposited Copper Foil )是铜电解沉积在阴极上生成的 铜箔. 其过程是铜原料溶解制成硫酸铜电解液,由电镀在不锈钢圆筒状阴极上形成铜镀层经 剥离即得到铜...
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这种铜箔绝大多数是采用压延铜箔(Rolled Copper Foil)或电解铜箔(Electrodeposited Copper Foil)。压延铜箔的延展性、抗弯曲性优于电解铜箔，压延铜箔的延伸率为20％～45％，电解铜箔的延伸率为4％～40％。
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Electrodeposited copper foil have been mostly applied to PCBs. Along with development of electron trade, requiement increasing and demand of performance becoming higher.
电解铜箔主要应用于PCB电路板,随着电子行业的发展,需求量日益增多,性能要求也越来越高,超薄、低轮廓铜箔具有广阔的发展前景。
参考来源 - 电解铜箔工艺条件及其添加剂的实验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
This paper introduces new technical achievement for waster water reutilization in electrodeposited copper foil production process.
文章介绍了在电解铜箔的生长过程中所产生的废水回收再利用的新技术成果。
Set up in 1955, Yates foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry.
美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。
This paper brief introduces the Physical chemistry process of heterogeneous response in the technical process of copper dissolved for produced process of electrodeposited copper foil.
该文简要地介绍了电解铜箔生产的溶铜工艺过程中多项反应的物理化学过程。
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