本研究采用无电镀法 本研究采用无电镀法 本研究采用无电镀法 本研究采用无电镀法 (Electroless Plating Method) 进行表面披覆 进行表面披覆 进行表面披覆 进行表面披覆。 。
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Rare earth improved electroless plating method was developed for simultaneously depositing Pd-Ag alloy film on ceramic support.
采用稀土改进的化学镀法在多孔陶瓷载体上共沉积钯-银合金膜。
The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer.
提供了保护过程的技术细节，首先在光纤表面进行化学镀处理获得导电的薄镍层或铜层，然后在该导电层上进行电镀镍。
The interaction process between current collector treated electroless plating indium and various mercury-free zinc powders was studied by a method of dynamic measuring exhaustion hydrogen.
采用析氢量动态测试方法研究了化学镀铟集流体铜钉与不同产地无汞、低汞锌粉相互作用的动态过程。
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