Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。
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