EPOXY MOLDING COMPOUND 材料 ; 环氧模塑料 ; 环氧塑封料 ; 环氧树脂
EPOXY MOLDING COMPOUNDS 材料 ; 环氧模塑料 ; 介绍了环氧树脂塑封料
glass fiber reinforced epoxy molding 玻璃纤维增强环氧膜塑料
EMC-Epoxy Molding Compound 环氧模塑料
epoxy molding compounds for semiconductors 半导体用环氧模塑料
epoxy molding compound emc 环氧模塑化合物
epoxy molding compound KL serles KL系列环氧摸塑料
molding epoxy resin 成型环氧树脂
epoxy molding compound MEfor semiconductor ME型半导体用环氧摸塑料
The epoxy molding compounds (EMC) was prepared by hot pressing molding method.
采用热模压法制备了环氧模塑料（EMC）。
The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.
本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.
对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
应用推荐