石墨烯基电子学研究进展 关键词：微机电系统(MEMS)；加速度传感器；反应离子刻蚀；高深宽比；深刻蚀 [gap=1200]Key words:MEMS；accelerometer sensor ；ICP etch ； high aspect ratio；deep etch
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中国印制电路行业协会 -- 不同电镀参数组合对高厚径比通孔电镀的影响 关键词 ： 高厚径比；通孔电镀；电流密度 [gap=478]Key words: high aspect ratio; through-hole plating; current density
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...高宽比、刚度比、受剪承载力比、周期比、位移比、刚重比、剪重比、轴压比 [gap=454]keyword] high-rise buildings, high aspect ratio, stiffness ratio, shear capacity, cycle ratio, displacement ratio, the ratio of..
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... artificially filling pedestal pile 挖孔灌注桩 high aspect ratio 大展弦比 electronic engineering 电子工程学 ...
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high aspect ratio region 大长宽比区
High aspect ratio trenches 高深宽比的沟开挖
high aspect ratio wing [航] 大展弦比机翼
high-aspect-ratio 大展弦比
high-aspect-ratio wing 大展弦比机翼
high aspect ratio micro-electromechanical systems 高向性微机电系统
high aspect-ratio 高深宽比
high-aspect ratio 大展弦比
In the MEMS field, microstructure withhigh height and high aspect ratio is often used. LIGA and UV-LIGA technologies are the very wayto fabricate this microstructures.
在微机械领域常需要用到具有一定厚度和高深宽比的微结构,LIGA 与 UV-LIGA 技术是制作这种微结构的重要手段。
参考来源 - UVThis is of high importance for the formation of LDHs with a high aspect ratio.
这是水热条件形成高长径比LDHs的重要原因所在。
参考来源 - 高长径比片层水滑石的制备、表征及其在光催化中的应用Generally, the width of high aspect ratio micro-structure is about 1～10μm ,height is 10～500μm , the deep aspect ratio is between 10:1 and 100:1.
通常MEMS高深宽比微细结构大约是宽度为1～10μm,高度为10～500μm的微结构,深宽比一般在10:1到100:1之间。
参考来源 - MEMS器件深槽侧壁形貌测试方法研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Microstructrue with high aspect ratio is widely used in MEMS.
在微电子机械系统(MEMS)中，大高宽比微结构被广泛应用。
A new method is presented, which can obtain high aspect ratio in SU8 structures.
提出了一种解决大高宽比su8结构的新方法。
High aspect ratio structures have been successfully fabricated by plasma cryo-etching on silicon wafers.
等离子体低温刻蚀是一种针对高深宽比结构的干法刻蚀技术。
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