Samsung Electronics announced that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.
三星电子最近宣布，他们发明出了工业界第一个TECOF装置，这能用于大屏幕、高分辨率的LCD电视中的显示器驱动器集成电路（DDI）。
Under pressure of the increase of chip scale and the decrease of timing to market, verification has become the bottleneck of digital IC design.
在芯片规模指数式上升和要求面市时间快速缩短的双重压力下，验证已成为数字集成电路设计的瓶颈。
Chip verification, especially functional verification has become one of the most difficult and challenging issues in IC design.
芯片验证，尤其是功能验证已成为当前集成电路设计中最困难、最具挑战的课题之一。
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