...但接着剂的耐热性与尺寸安定性不佳，长期使用温度限制在100~200，使得三层有胶软板基材（3-Layer Flexible Copper Clad Laminate,3-Layer FCCL）的领域受限。
基于4个网页-相关网页
3-Layer Flexible Copper Clad Laminate 使得三层有胶软板基材
Various polyimide was synthesized from 3-BAPP with various dianhydrides. The application of the polyimiders to two-layer flexible copper clad laminate(2L-FCCL)was researched.
用3-BAPP与多种二酐合成出多种聚酰亚胺，并在二层法挠性覆铜板（2L-FCCL）的应用方面做了一些研究。
In recent years, flexible printed circuit boards based on two layer flexible copper clad laminate has been widely applied in folding mobile phone, digital camera and notebook computer etc.
近年来，以二层覆铜板为基材的挠性印制电路板，具有薄、轻、结构灵活的鲜明特点，被广泛应用于折叠手机、数码相机、笔记本电脑等。
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