Microsoft Word - 6.doc 关键词： 无铅焊料；金属间化合物；时效 [gap=1783]Key words: lead-free solders; intermetallic compounds; aging
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Test method for lead-free solders 无铅焊料试验方法
Lead-free solders and flux 无铅钎料及钎剂
Test methods for lead-free solders 铅制焊料的检测方法
New lead-free solders have been used in industry.
新型的无铅钎料已在工业生产中得到了应用,但在性能上仍存在着不足。
参考来源 - Sb对SnThe formation and distribution of Intermetallic Compounds （IMCs） in the microstructure of lead-free solders which acts as the thermal, electronic and mechanical connections, directly affect the soldering performance during micro- electronic packaging process.
微电子封装工艺中,起到热、电和机械连接作用的无铅焊料合金组织中金属间化合物的形态和分布直接影响着该合金的连接性能。
参考来源 - Sn·2,447,543篇论文数据，部分数据来源于NoteExpress
So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.
因此开展低成本无铅焊料润湿性和焊点电迁移研究非常有必要。
The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed.
文中介绍了三种典型无铅焊料体系的不足之处，以及银导电胶研究中的三个难题。
In combination of our recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合我们的研究成果，详细介绍了无铅钎料开发的现状及前景。
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