• 纳米银焊膏 - 引用次数：2

  In this paper, a series of reliability tests were designed to investigate the interconnection reliability of low-temperature sintered nano-silver paste. And dynamic mechanical properties of this interconnection material were also studied.

  本文通过设计一系列的可靠性试验从多个方面研究了低温烧结纳米银焊膏粘接技术的可靠性,还研究了此种连接材料的基本动态力学性能。

  参考来源 - 纳米银焊膏低温烧结粘接可靠性研究

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