The dislocation etch pits density(EPD) of copper single wires is related with corroded time, deformative extent and crystal orientation of material.
铜单晶线材中位错蚀坑密度与材料浸蚀时间，变形量以及晶体学取向有关。
Test results show that the yield characteristics of DD3 single crystal depend on test temperature, strain rate, and orientation of samples.
试验发现，单晶DD3的屈服特性随温度、应变率、晶向而变化。
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