... packaging machine 封装机,包装机,打包... packaging density 封装密度,组装密度... packaging industry 包装工业 ...
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... packaging 包装,封装,组件,插件,标准部件 packaging density 封装密度 packaging machine 打包机 ...
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high packaging density 高组装密度
density of packaging 封装密度
high density packaging 高密度封装 ; 高密度组装
high density electronic packaging 高密度电子组装 ; 高密度电子封装
HDEP High Density Electronic Packaging 高密度电子封装
hellogh density packaging 高疏密程度封装
high-density packaging technique 高密度组装技术
high density packaging technique 高密度组装技术
·2,447,543篇论文数据,部分数据来源于NoteExpress
With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高,计算机发热密度近年来一直呈指数级增长。
Shockproof packaging can be compared with the cutting, forming; due to greater difference in density can also have a wider range of uses.
相对于防震包装可以切割、成型;因密度差异较大,还可以有更为广泛的用途。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
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