...(氮氧化矽)薄膜沉积 II-V 刻蚀应用(III-V etching) 沟槽刻蚀(Trench etching) 钝化层刻蚀(Passivation etching) 聚酰亚胺刻蚀(Polyimide etching ) 亚纳米级刻蚀(Submicron etching) BM8-II 反应离子刻蚀(RIE)/沉积(PEVCD)等离...
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Silicon plane technique with etching groove and low temperature passivation is proposed to overcome low-breakdown for increasing the finished product rate and reliability of the plane powerful tube.
为提高硅平面大功率管的成品率和可靠性,提出了一种刻蚀槽和低温钝化相结合的克服低击穿的硅平面枝术。
Device Processing: Etching. Surface passivation; dielectric films.
元件制程:蚀刻,表面钝化,介电材料薄膜。
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