cyanide zinc plating solution 氰化锌电镀
cyanide copper plating solution 氰化镀铜 ; 氰化
semi-bright nickel plating solution 半光亮镍电镀
brush plating solution 电刷镀溶液 ; 刷镀溶液
electroless plating solution 化学镀液
Chrome Plating Solution 铬电镀液 ; 镀铬溶液
Hull trough test and TEM analysis indicated that covering power of plating solution improved, crystallite of plating is careful, luminous area is increased when we added the assembles chemical organic additives by oneself in the electrocoppering. It can nearly achieve the overseas dye’s effect.
赫尔槽实验和TEM分析研究结果表明：酸性电镀铜溶液中加入自配有机添加剂，镀液深镀能力较好，铜镀层晶粒细致，光亮面积增加，接近于国外染料的效果。
参考来源 - 有机添加剂在印制电路板镀铜中的作用及其工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Plating solution surface tension is too large, wetting agents insufficient.
电镀溶液表面张力过大，湿润剂不足。
When to use two kinds of different performance of plating solution, the production very favorable.
当采用两种性能不同的镀液时，对生产十分有利。
Some additional salt can improve the deep plating solution, scattered ability, ability to create a fine plating.
有些附加盐还能改善镀液的深镀能力﹐分散能力﹐产生细致的镀层。
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