公布 中文名称： 抛光片 英文名称： polished wafer 定义：经过单面或双面化学机械抛光加工的半导体晶片。 应用学科： 材料科学技术（一级学科） ； 半导体材料（二级学科） ；元素半导体材料（二级学科） 基于1个网
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monocrystalline silicon polished wafer 硅单晶抛光片
Ge polished wafer Ge抛光片
silicon polished wafer Si抛光片
Double Side Polished Wafer 双面抛光硅晶片
polished silicon wafer 等抛光硅晶圆 ; 晶圆
Because of the reflection on the back surface the minority carrier generation and illuminated surface photovoltage of both sides polished wafer will be higher than one of single side polished wafer.
由于背抛光面对受光面入射光的反射，使得少子产生率和受光面表面光电压都高于单面抛光片。
By splitting a laser beam and aiming each part onto opposite sides of a polished silicon wafer, the group engineered a system of reflection and interference that traps both beams in the silicon.
这组人员设计了一个反射和干涉系统，将激光分成两束，分别对准抛光硅晶片的两面，将两束光限制在硅当中。
Tetrahedral amorphous carbon (ta-C) films have been deposited on P-type (100) polished c-silicon wafer with different substrate negative bias by filtered cathodic vacuum arc technology.
采用过滤阴极真空电弧技术并施加一定的衬底负偏压，在P（100）单晶硅片上制备出四面体非晶碳薄膜。
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