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ANSYS mechanical technology can be used to predict thermal, mechanical and moisture-driven stress and strain in a variety of package types.
在各种各样的封装类型中，利用ANSYS机械模块技术可以预测热力、机械和湿气引起的应力和应变。
The model can be used to predict the thermal and mechanical data such as temperature, strain, strain rate distributions.
应用该方法可以给出轧件变形过程中诸如温度场、应变场和应变速率场等各种热力结果。
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