纯锡电镀
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lead-free pure tin electroplating 无铅纯锡电镀
neutral pure tin electroplating 中性纯锡电镀
pure tin electroplating
以上为机器翻译结果，长、整句建议使用 人工翻译 。
An additive for matt pure tin electroplating was developed by electrochemical and chemical methods.
运用电化学和化学方法开发了一种亚光纯锡电镀添加剂。
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Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
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