Using the continuous sending laser light source and semiconductor photoelectric position sensitive device, a high accurate tri-dimensional non-contact optical measurement system is designed.

利用连续发射的激光光源和半导体光电位置敏感器件，设计了一种三维非接触高精度的光学测量系统。

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An intelligent coated plate thickness measurement system based on a semiconductor laser diode as light source and a CMOS image sensor is introduced.

介绍了一种以半导体激光器为光源，以新型CMOS面阵图象转换器件为传感器的智能型覆铜板测厚系统。

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On the above basis, a dimension measuring system that USES semiconductor laser as its light source and PSD as the receiver, is proposed. Its precision is verified by experiments.

在此基础上，提出了一种采用半导体激光器作光源，PS D作光电接收器的尺寸测量系统，并通过实验对其精度进行了验证。

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