By splitting a laser beam and aiming each part onto opposite sides of a polished silicon wafer, the group engineered a system of reflection and interference that traps both beams in the silicon.

这组人员设计了一个反射和干涉系统，将激光分成两束，分别对准抛光硅晶片的两面，将两束光限制在硅当中。

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Tetrahedral amorphous carbon (ta-C) films have been deposited on P-type (100) polished c-silicon wafer with different substrate negative bias by filtered cathodic vacuum arc technology.

采用过滤阴极真空电弧技术并施加一定的衬底负偏压，在P（100）单晶硅片上制备出四面体非晶碳薄膜。

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