Solder bump 球状的焊锡材料粘合在无源或有源元件的接触区 ; 焊料隆起焊盘 ; 撞击焊 ; 焊接凸点
Eutectic Solder Bump 共晶接合
stencil printing solder bump 印刷凸焊点
Solder Bump on Copper Stud 铜接线柱焊凸
Solder r bump 球状的焊锡材料粘合在无源或有源元件的接触区
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
The manufacture of solder bump is one of the key technologies for area array packaging (AAP).
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
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