2.4 粘附性(tack) 2.5 焊料球(solder ball) 1)将上表面附有焊膏的试样以(25±2)mm/s的速度水平浸入浸焊槽,直到试样厚度的一半被浸入浸焊槽的焊料为止。
基于74个网页-相关网页
ECO SOLDER BALL 千住锡球
Solder Ball Interconnect 焊料凸点互连
No solder ball after reflow 回流过程中不出现焊锡珠
Solder ball test 锡球试验
lead solder ball 中心定位引线焊球
mid-chip solder ball 片式元件间锡珠
Adaptive algorithm is used to realize IMC growth during simulation, and energy fatigue model is used to predict solder ball lifetime.
采用改进算法,在计算过程中引入了IMC厚度的变化,利用能量法预测了焊球寿命。
参考来源 - BGA封装器件焊球剪切实验及模拟研究The electromagnetic stirring was carried out in the process of solder joint formation in the lead-free solder ball and substrate by means of revolving permanent magnets. Consequently, some defects were found through analysis, causing negative impacts on solder joints reliability.
利用旋转永磁体法对无铅焊料球和基板在受热形成焊点的过程中实施电磁搅拌,试验之后,通过分析结果,发现该方法存在缺陷,对焊点可靠性有不利影响。
参考来源 - 基于电磁搅拌的无铅互连新方法的初步研究·2,447,543篇论文数据，部分数据来源于NoteExpress
For example of solder ball, flux residues, clamping marks.
如锡珠，助焊剂痕迹，夹抓纹之清理。
At the same time, experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
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