The different temperature generates the difference of atomic fluxes and IMCs growth rates at the cathode, which also causes the nonuniform electromigration degree in different solder joints.
不同焊点的温度差异引起了阴极界面的原子净流量和IMC的生长速率差异，导致不同焊点的电迁移程度差异。
Generally the same fluxes will work for lead-free solder.
一般来说，相同的焊剂用于无铅焊料是有效的。
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