基于FEA的Cu pad模型对焊点可靠性的影响分析_电子行业学术文章_质量学术文章_电子质量E周刊 关键词： Cu pad；焊点可靠性；有限元；BGA [gap=616]Key words: Cu pad;Solder Joint Reliability;finite element;BGA
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The results show that the lesser elasticity module and Coefficient of Thermal Expansion can availably reduce thermal stress, affect the package warpage and the solder joint reliability are the substrate thickness and the die thickness.
计算结果表明，采用较小的弹性模量和热膨胀率的材料可以有效地减小热应力；基板和芯片的厚度是影响封装体热变形和焊点可靠性的主要因素。
参考来源 - 集成电路芯片封装的热—结构数值模拟分析及优化设计·2,447,543篇论文数据，部分数据来源于NoteExpress
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。
It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.
研究现状表明快速冷却有助于减少焊接缺陷，提高焊点可靠性。
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