Furthermore, the formation of cracks results in the degradation of solder joint strength, but affects mildly to the electrical properties.
裂纹的产生导致了两种焊点强度的降低，对其电性能的影响却甚微。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
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