The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
Surface Mount technology is extensively applied in the assembly of electronic components and PCBs. The article illustrates some of the concerns in SMT processing technology on PCB designs.
表面安装技术在许多电子产品的生产制造中已被大量采用，本文就表面安装PC B设计时需考虑的一些制造工艺性问题进行了阐述。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
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