Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
Exploring improved thick film technology and using new materials to improve the thick film high frequency feature is the only way to bring thick film hybrid in 1c to the high frequency application.
探索采用厚膜改进型工艺方法及使用新型材料，从而改变其成膜高频特性是唯一能使厚膜向高频方面迈进的必径之路。
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