...点可靠性的影响 l 金属渗析 l 热损伤 l 空洞对焊点可靠性的影响 6．PCBA使用过程中的工艺可靠性问题与解决 l 锡须（Tin Whisker） l Kirkendall空洞 l 导电阳极丝(CAF):典型案例讲解 l 电迁移 l 助焊剂残留造成的腐蚀失效 l 特殊工作环境对工艺可靠性的要求:典...
基于473个网页-相关网页
锡晶须形成的影响因素研究 关键词：锡晶须；电镀；结晶组织 [gap=547]Key words：Tin whisker，Plating，Crystal structure
基于44个网页-相关网页
The contrast experiment result shows that, among the 5 factors of plating process which may affect tin whisker growth, only plating chemical and annealing have great effect to tin whisker growth.
对比实验结果发现,在电镀工程中对锡须生长可能有较大影响的五个因素中,只有电镀和退火对镀层锡须生长有较大影响,而其他三个因素对锡须生长影响不大。 另外,对于电镀,甲基磺酸电镀液的镀层抑制锡须生长的能力更强。
参考来源 - 抑制引线框架锡须生长的电镀工艺·2,447,543篇论文数据，部分数据来源于NoteExpress
However, it suffers from some problems such as tin whisker, surface color changes and bath mudding.
但纯锡电镀中存在着许多问题，如锡晶须、镀层变色及镀液混浊等。
When adding stress with ambient temperature storage, the formation of tin whisker was completely inhibited.
当施加恒定外应力后进行室温处理，锡须的形成完全受到抑制。
However, it is generally thought that the market demand for environmentally friendly components will eventually outweigh the potential for tin whisker component failure.
然而，人们普遍认为环保组件的市场需求将最终超过潜在的锡晶须组件失败。
应用推荐