With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
The displacement sensing method with laser interference is a new method for measurement of vibration and deflection of engineering structure.
利用激光干涉位移传感法测量了结构物的高面位移。
It introduces a new technology of audio measurement. A laser vibration measurement meter was used in conjunction with a function signal generator and a multi-channel signal analyzer to measure audio.
介绍一种采用激光测振仪配合函数信号发生器、双踪示波器检测音响系统动态特性的新技术。
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