wafer bonding 通过金属层来接合 ; 晶片接合
Wafer Bonding Technology 晶圆键合技术
Wafer Bonding Technique 片键合技术 ; 硅片粘合技术
SIMOX wafer bonding technology 注氧键合技术
wafer bonding and mechanical thinning 键合减薄
using wafer bonding 硅片键合
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以上来源于: WordNet
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
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