Toshiba did not say how many its wafer fabs have been directly affected by events on Friday or are now being closed due to the power saving decision.
东芝并没有公布其属下的芯片厂在上周五的地震中有哪几间受到了直接的影响,也没有公布哪几间芯片厂会受到这次断电行动的影响。
TSMC Chief technology Officer Jack Sun said last year at an IC-technology forum in Germany that a move to 450mm wafer fabs is important for cost reduction.
台积电首席技术官孙元成在去年于德国举办的一次芯片技术会议上曾表示450 mm晶圆厂的设立对芯片厂减少成本具有重大意义。
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