selective wet chemical etching 化学湿法刻蚀
wet chemical etching technique 湿法化学腐蚀
Anisotropic wet chemical etching 各向异性湿法化学腐蚀
chemical wet etching 光刻刻蚀
Laminar flow assisted wet chemical etching.
三.层流辅助湿法腐蚀。
参考来源 - 微流控芯片中层流现象的研究与应用·2,447,543篇论文数据，部分数据来源于NoteExpress
Wet chemical etching of sacrificial layers plays an important part in fabricating movable tree-dimensional micromachines by combination with MEMS technologies.
牺牲层腐蚀技术结合MEMS技术是制作三维可动微机构的一个重要加工手段。
This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.
本文介绍了选用优质石英为芯片基体材料的一种制作方法，关键技术包括标准的光刻，湿法腐蚀，键合等微加工技术。
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