This paper describes new development of wet plating process in micro fine circuit formation. It can form micro fine circuit pattern on improved performance polyimide film.
概述了在微细线路形成中湿式镀工艺的新开发，可以在改性聚酰亚胺膜上形成微细线路图形。
Performance, spinning technology circulation, parameters choice of each process, technology measures and development direction of conduct wet polyester fibers were introduced.
介绍了导湿涤纶纤维的性能、纺纱工艺流程、各工序的工艺参数选择、技术措施、质量指标及今后的开发方向。
应用推荐