The simulation results can guide the packaging of the high power semiconductor laser array.
该模拟结果对大功率半导体激光器阵列的封装设计具有现实的指导意义。
The heat of high power semiconductor laser array is absorbed by a semiconductor refrigerator and dissipated by air cooling.
它利用半导体制冷器对大功率半导体激光阵列吸热，然后经由风冷散热。
The theory of side pumping Nd:YAG laser by high-power array-semiconductor laser cluster are discussed, on the basis of this theory, we design, make and justify the laser, and measure its data.
本文论述了大功率列阵半导体激光器组侧泵浦YAG激光器的工作原理，在此基础上进行设计、制作并对激光器进行调试和性能参数测量。
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