... multiband chip ambit 多层集成电路 multilayer interconnection 多层互连 multilayer lightguide 多层光波导 ...
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... multilayer insulation || 多层绝缘 multilayer interconnection || 多层布线，多层接线 (集成电路的 ) multilayer metallization || 多层布线，多层接线 (集成电路的 ) ...
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Dishing problem of copper multilayer interconnection in ULSI was introduced, and the reasons and influencing factors were analyzed.
介绍了UL SI多层铜互连线中的碟形坑问题，对其产生的原因及影响因素进行了分析。
Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same.
金属还原方法，多层互连结构及制法，半导体器件及制法。
Finally the relationship between high - order interconnection and multilayer network architecture is discussed.
本文最后讨论了高阶连接和多层网络结构的关系。
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