导电银胶（silver conductive adhesive），使用银粉做导电填料的导电胶粘剂， 导电银胶最大的优点是，能粘接温度敏感器件，能够粘接不可焊接，或者难焊接，但要求导通的...
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SILVER CONDUCTIVE ADHESIVE PASTE 流体状银导电胶
non-silver conductive adhesive 非银导电胶
silver paste conductive adhesive 银浆导电胶
silver epoxy conductive adhesive 耐热环氧胶粘剂
The relation between the resistivity of conductive adhesive and the volume fraction of silver fillers was studied.
在电子工业中应用最广泛的导电胶粘剂是以银粉为导电填料以环氧树脂为粘合剂的体系。
The effects of silver particles morphologies and size on the electrical bulk resistivity of conductive adhesive were described.
从导电性角度考查银粉颗粒形貌和粒径大小对导电胶电阻率的影响。
In order to obtain better conductive functional filler and conductive adhesive, the surface of carbon nanotube (CNT) was wrapped by silver using chemical plating.
采用化学镀法在碳纳米管表面包覆金属银，从而获得了导电性极好的纳米银-碳复合管，并以该复合管为导电功能体制备导电胶。
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