... 隆起焊盘形成 bumping ; bumping,bumping 焊料隆起焊盘 solder bump ; solder pad 金隆起焊盘 goldbump ...
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... 变色 (发黄,发黑,发花,水渍,酸斑)Discolor (Yellowish, Blacken,Water Mark) 锡球 Solder Pad 镀层偏厚或偏薄 Thick or Thin Plating ...
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Solder pad copper exposured 锡垫露铜
solder pad size 焊盘尺寸
SOLDER PAD LAYOUT 焊接尺寸
Solder Pad Design 焊盘设计
The solder pad pinch of the device also decreasing rapidly.
焊球尺寸的减小导致了焊球强度也随之降低。
When the first signal defect is produced, make the signal-exerting solder pad mutually short-circuit.
在产生第一信号缺陷时，使所述信号施加焊盘相互电短接。
The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.
讨论了弯曲跨距、焊盘尺寸等参数、以及焊点所经历的回流、老化等热过程对PC B焊点弯曲可靠性的影响。
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