The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
这一新型的DDI装置相比传统的COF能提高散热量达20%，因此使得DDI能运行更长时间，并且可靠性更好。
The effect of the thermal resistance at two interfaces on heat dissipation capability of the SWS is analyzed.
分析了两个接触处的界面热阻率对慢波结构散热性能的不同影响。
The method for calculating power dissipation and some cautions for thermal design are provided in the end.
最后介绍了计算系统功耗的方法和芯片散热设计的注意事项。
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