3.2.6.3 铅锡(Tin-lead) 镀铅锡须满足 ASTM B-579 要求(锡含量为 50-70%)。除非选用非熔融方式,应用熔融方 式厚度应按Table3-2 要求。
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tin-lead solder 锡铅焊料 ; 锡铅钎料
tin-lead plating 镀锡铅 ; 电镀铅锡
tin lead solder [机] 锡铅焊料 ; 锡铅软焊料
Tin Lead 触点电镀
Casting tin-lead solders 铸造锡铅焊料 ; 铜及铜合金散热扁管
Tin lead over Nickel 触点电镀 ; 外壳电镀 ; 触点涂层端子
tin lead alloy 锡铅合金
tin lead plating 镀锡铅合金
Lead, tin and tin-lead alloy electroplating technologies using these two products are introduced.
介绍了采用两种产品的电镀铅、锡及铅-锡合金工艺。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
Gold, silver, bronze, iron, tin, lead.
金,银,铜,铁,锡,铅。
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