... Wafer bonding process 制造工艺 收藏 Bonding adhesive 黏结剂; 胶粘剂; 芯片键合用粘合剂 收藏 bonding invalidation 键合失效; 静止目标识别 收藏 ...
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According to the present invention, defects of traditional wafer bonding process can be avoided.
本发明可避免传统晶片粘合工艺的缺点。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
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