系统采用包装器外观设计模式及COM软件技术封装仪器驱控制组件。

Instrument control components are enveloped with com software technique and wrapper fa? Ade design pattern.

youdao

系统采用包装器外观设计模式及COM软件技术封装仪器驱控制组件。

Instrument control components are enveloped with com software technique and wrapper fa? Ade design pattern.

youdao