印刷电路板镀金遮蔽保护用。

Used in the masking operation during wave solder process on PCB.

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适用于镀金过程中保护印刷电路板。

For protecting PCB in the process of gold plating.

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适用于镀金过程中保护印刷电路板。

For protecting PCB in the process of gold plating.

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