The mechanism of the chemical etching is discussed.
并对可能的腐蚀机理进行了探讨。
Furthermore, the mechanism of the chemical etching has been discussed.
并对可能的腐蚀机理进行了探讨。
The crystal defects were studied by optical method and chemical etching method.
用光学法和化学腐蚀法研究了晶体的缺陷，并分析了缺陷成因。
The chemical etching was an effective way for relieving of machining residual stress.
化学蚀刻是消除铍材机加应力的有效方法。
Chemical etching and high temperature heating were used for pretreatment of substrates.
衬底预处理采用化学刻蚀和高温处理。
Stencil manufacturing techniques include chemical etching laser cutting and electroforming.
钢网制作技术包括化学腐蚀，激光切割和电铸。
Abstract: The black silicon has been successfully produced by Au particle-assisted chemical etching.
摘要：采用金催化化学腐蚀和钝化两个过程成功制备了黑硅。
Also, severe biofouling, physical abrasion, and chemical etching of the glass may erode the sensing surface.
严重的玻璃生物淤积、理磨损和化学腐蚀可能影响感觉表面。
The twins in NYAB and NGAB crystals were investigated by synchrotron radiation topography and chemical etching method.
采用同步辐射形貌术结合化学腐蚀法，系统研究了NYAB和NGAB晶体中的孪晶结构。
Characterization method of defects in silicon carbide by chemical etching and optimal process parameters are obtained.
论文得到了用腐蚀法表征碳化硅材料缺陷的方法和优化的工艺参数。
The shape, distribution and density of etch pits on the (101) face was observed by metalloscope after chemical etching.
单晶，通过化学腐蚀和金相显微镜研究了（101）晶面蚀坑的形貌、分布特征及其密度的大小。
The technics of chemical etching, chemical polishing and chromium electroplating for stainless steel mould were studied.
研究了不锈钢模具板的化学蚀刻、化学抛光和电镀铬工艺。
This paper investigated the law of KPB crystal twinning using microcrystallography, chemical etching and optical method.
本文采用显微结晶、化学浸蚀和光学方法研究了KPB晶体的孪生规律。
The technics of chemical etching, chemical polishing and chromium electroplating for stainless steel mould were studied.
采用化学蚀刻法测定了氚在不锈钢材料中的纵向分布。
Different technologies are available to directly mark objects: laser / chemical etching, dot peening and ink jet printing.
不同的技术可帮助实现此直接印刻的工艺，如激光/化学雕刻、点式打标和喷码打印技术。
The chemical etching condition of CR-39 solid state nuclear track detector for neutron measurement was optimized by experiment.
通过实验确定了CR - 39固体核径迹探测器用于中子测量的化学蚀刻条件。
The mechanism and process of fabricating fiber probe by combining the static and dynamical chemical etching methods is analyzed.
理论上分析了静动结合的化学腐蚀法制备探针的具体机理及过程。
Experiments are performed to confirm the chemical etching method for defining the crystallographic orientation of silicon single crystals.
通过实验肯定了硅单晶的化学侵蚀定向方法，找出抛光液的最佳配比及抛光时间。
The chemical etching method wa applied to form surface texture of multicrystalline silicon in order to reduce the reflectance of the surface.
为了降低光在多晶硅表面的反射，采用化学腐蚀法在其表面制备了绒面。
The invention also discloses a chemical etching agent matched with the compound to take deep etch to glass, silicon water and metal material.
本发明还公布了与光成像组合物配合使用，对玻璃，硅晶片、金属基材等进行深度刻蚀的化学刻蚀剂。
In the processing of the mold texture, the traditional chemical etching exits the shortcomings of the pollution and the long processing cycle.
在模具纹路加工中，传统的化学蚀刻方法存在污染大、加工周期长的缺点。
The technics can been applied to surface treatment of chemical etching, chemical polishing and chromium electroplating for different kinds of stainless steel.
该工艺可以用于各种类型不锈钢的化学蚀刻、化学抛光和电镀铬处理。
The crystal was characterized by four-crystal X-ray diffraction, chemical etching, optical microscope, transmission spectra and atomic force microscope (AFM).
通过四晶X射线衍射、化学腐蚀、光学显微、透过光谱以及原子力显微镜对晶体的质量进行了表征。
Wet chemical etching of sacrificial layers plays an important part in fabricating movable tree-dimensional micromachines by combination with MEMS technologies.
牺牲层腐蚀技术结合MEMS技术是制作三维可动微机构的一个重要加工手段。
The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。
By observing and analyzing the formation of PPS with chemical etching, a new model of PPS formation was proposed: inverse crystallography model of PPS formation process.
通过观察和分析多晶多孔硅化学腐蚀机理提出了一个新模型：多孔硅形成机理的逆结晶学模型。
This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.
本文介绍了选用优质石英为芯片基体材料的一种制作方法，关键技术包括标准的光刻，湿法腐蚀，键合等微加工技术。
In the study, in order to get good precision of dimension and position of fine leads, chemical etching method is used to make high density double assess single-sided FPC.
研究采用化学蚀刻聚酰亚胺的方法来制作双面连接的单面挠性板，以满足精细手指的尺寸和位置精度的要求。
In the study, in order to get good precision of dimension and position of fine leads, chemical etching method is used to make high density double assess single-sided FPC.
研究采用化学蚀刻聚酰亚胺的方法来制作双面连接的单面挠性板，以满足精细手指的尺寸和位置精度的要求。
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