Chemical Mechanical Polishing(CMP); abrasive particle; modeling; wafer;
机械化学抛光；磨粒；建模；芯片；
Polishing pad conditioning is very important for chemical mechanical polishing to improve the performances of a pad.
抛光垫修整是化学机械抛光的重要过程之一。
A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (a) a styrene polymer and (b) a diene polymer.
一种化学机械抛光垫，包含由(A)苯乙烯聚合物和(B)二烯聚合物构成的非水溶性基质。
Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
We have to face some Cu line issues after we use Cu to replace AL, such as the reliability with Cu and low K dielectric, and post-CMP (Chemical Mechanical Polishing) Cu line voids defect.
在引入电镀铜工艺的同时我们也不得不面对一些铜线工艺所特有的缺陷，如铜线和低K值介电质可靠性问题，以及电镀铜后产生的孔洞缺陷等问题。
The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
The mechanism of W-CMP was analyzed, the slurry makes a dual function of chemical erosion and mechanical lapping, has an important influence on the polishing rate.
分析了W -CMP的机理，抛光液对W材料表面具有化学腐蚀和机械研磨的双重作用，对抛光速率有着重要的影响。
A complete bright silver plating process for deluxe tableware including chemical polishing, mechanical polishing, degreasing, cleaning, nickle plating, silver plating and post-treatment is suggested.
介绍餐具光亮镀银的全套实用工艺，包括化学抛光、机械抛光、除蜡、除油、镀镍、镀银、以及镀后处理等。
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
In this paper mechanical polishing; Chemical polishing and hydrogen reduction methods used im cleaning bearing steel surface for oxygen determination have been studied.
本文研究了用机械抛光、化学抛光和氢还原法处理轴承钢表面对测定氧的影响。
Polishing pad is a very important component of the chemical-mechanical polishing (CMP) system.
抛光垫是化学机械抛光(CMP)系统的重要组成部分。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Single stage re-circulation filtrations were performed to remove oversized particles from colloidal silica based Chemical-Mechanical Polishing (CMP) slurry.
单步循环过滤，用来去除胶体硅基化学机械抛光(CMP)磨料中尺寸过大的微粒。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
In Chemical-Mechanical polishing experiments we produced optical quality super smooth surfaces on single-crystal silicon, but cannot insure the surface figure.
使用机械 -化学抛光法加工大尺寸单晶硅可获超光滑表面 ，但很难保证良好的面型。
The invention further provides methods of polishing a substrate using each of the above-described chemical-mechanical polishing compositions.
本发明进一步提供一种使用上述各化学机械抛光组合物抛光基材的方法。
The invention is a combined chemical-mechanical polishing method, firstly primarily polishing a to-be-flattened layer by first polishing disc in the first polisher platform;
一种复合式化学机械抛光法，是先在第一抛光机台中，以第一抛光盘 对待平坦层进行初步的抛光。
Embarked from the component and structure of phosphate laser glass, its chemical-mechanical polishing (CMP) mechanism is analyzed.
从磷酸盐激光玻璃的成分和结构出发，分析了其化学机械抛光(CMP)机制。
Embarked from the component and structure of phosphate laser glass, its chemical-mechanical polishing (CMP) mechanism is analyzed.
从磷酸盐激光玻璃的成分和结构出发，分析了其化学机械抛光(CMP)机制。
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