A quantitative mechanism of particle removal from silicon wafer surfaces by wet chemical cleaning process was proposed.

对化学法清洗硅片过程中消除颗粒的机理作了定量的探讨。

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A quantitative mechanism of particle removal from silicon wafer surfaces by wet chemical cleaning process was proposed.

对化学法清洗硅片过程中消除颗粒的机理作了定量的探讨。

youdao