The AC complex impedance method is widely used to charactrize electronic materials.
ac复阻抗方法已广泛地用于表征电子材料。
DSC, DMA, complex impedance analysis, SEM, and AFM were used to investigate the properties and morphology of the system.
运用差示扫描量热分析、动态力学分析、交流复阻抗谱、扫描电镜和原子力显微镜对体系性能和形态进行了研究。
Infrared analysis, DSC analysis and complex impedance analysis were used to study structure and ionic conductive property of this system.
通过红外光谱分析、DSC分析以及复阻抗谱分析等方法对体系的结构及离子导电性能进行了研究。
Through complex impedance spectra, SEM, XRD etc. tests, it was proved that the microstructure and PTC properties of the material were improved.
经复阻抗谱、SEM及XRD等测试分析表明，材料的微观结构得到了明显改善，PTC性能得以提高。
The conduction types and equivalent circuits have made further study based on complex impedance plots of the sensor in different relative humidity.
利用复阻抗分析进一步研究了元件在不同的湿度环境中的导电类型和等效电路。
For every lumped element a expression of the complex impedance with unified integral form and a capacitance formula in integral form are also given.
文中还给出了四种元件复阻抗的统一表达式和一个积分形式的电容公式。
Some useful conclusions are presented by MATLAB analyzing on ladder-shaped complex impedance network, and concerned calculation formula is introduced.
利用MATLAB对梯形复阻抗网络进行了分析计算，得出了一些有益的结论，并推导了有关的计算公式。
The equivalent circuit model of the CGO film was recommended, and the complex impedance spectroscopy of the CGO film was analyzed at different test temperatures.
提出了阻抗谱的等效电路，并对不同测试温度下CGO的阻抗谱进行了分析。
The complex impedance of the sensor was determined under various humidities to provide one requirement for selecting of parameters in the design of measuring circuit.
测定了这种传感器在不同湿度下的复数阻抗，为测量线路设计中的参数选择提供了必要的依据。
Tests of swelling curves, infrared spectra analysis and complex impedance analysis were carried out to understand structure and ionic conductive properties of the samples.
通过溶胀曲线测定、红外光谱分析、复阻抗分析等手段对材料的结构与离子导电性能进行了研究。
The resistivities of grain and grain boundary were measured by the method of complex impedance analysis, the deficit compensation mechanism of donor acceptor was analyzed.
采用复阻抗方法测量了晶粒、晶界电阻值，初步分析了施受主的缺陷补偿机制。
Fourier transform infrared spectroscopy, Raman spectroscopy and complex impedance analysis were used to investigate the polymer-ion interaction and ionic conductive property of the system.
运用傅里叶变换红外吸收光谱、拉曼吸收光谱和交流复阻抗谱对该体系中聚合物-离子之间相互作用和离子导电性能进行了研究。
Electric currents: electric current, Ohm's law, conductivity, Kirchhoff's laws, time varying currents, free and forced oscillations, condensers, inductance, complex impedance, resonant circuits.
电流：电流，欧姆定律，电导率，基尔霍夫定律，时变电流，自由和强迫振荡，电容器，电感，复阻抗，谐振电路。
They are characterized by ruggedness, light weight, high sensitivity, low acoustic impedance, easy conformability to complex surface, low cost and large bandwidth.
它具有耐磨、量轻、灵敏度高、声学阻抗低、容易固定在复杂的表面、价格便宜，频带宽等特点。
The article introduces the development process of the complex transistor of high impedance, including the design of structure parameter, artwork layout and the development result.
本文介绍了高阻抗复合管的研制过程，包括结构多数的设计，工艺设计，以及研制结果。
For the convenience of time -domain convolution, the vector fitting method is adopted to approach the characteristic impedance and delay function in complex frequency-domain.
为了便于时域卷积，对不同模量上的特征阻抗和延时函数在复频域采用矢量匹配法进行拟合。
The inhibition effect of environmental friendly inhibitors such as tungstate and its complex for carbon-steel corrosion in simulated water is studied by using AC impedance and polarization curves.
采用电化学交流阻抗法和极化曲线法研究了环境友好型缓蚀剂钨酸盐及其复配对模拟水中碳钢的缓蚀作用。
But for high frequency problem and complex structure, too dense grid of object will lead to dense impedance matrix and many unknown variables, so the computational efficiency will be very low.
但是在处理高频问题和具有精密结构的缝隙时，对目标剖分过密会导致稠密的阻抗矩阵，未知量增加，影响计算的效率。
Existing wideband matching technologies have to frequently adjust circuit parameter to trade-off between impedance matching and noise matching. This makes the design complex.
现有的宽带匹配技术需要反复协调电路参数，在阻抗匹配和噪声匹配之间折衷，给设计增大了难度。
Existing wideband matching technologies have to frequently adjust circuit parameter to trade-off between impedance matching and noise matching. This makes the design complex.
现有的宽带匹配技术需要反复协调电路参数，在阻抗匹配和噪声匹配之间折衷，给设计增大了难度。
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