Curing and the dispersion of filler are two important factors for the conductive adhesive.
固化和填料的分散性是影响导电胶粘剂的两个重要因素。
The two major properties of the conductive adhesive are electrical and mechanical properties.
电性能和力学性能是导电胶粘剂的两大主要性能。
The conductive adhesive layer is introduced between the active material layer and the collector;
通过在活性物质层和集电极之间引入一层导电粘结剂层。
Is there evidence that the floor was installed using conductive adhesive with copper earth grounding straps?
是否有证据证明导电地板黏有铜线来接地？
The relation between the resistivity of conductive adhesive and the volume fraction of silver fillers was studied.
在电子工业中应用最广泛的导电胶粘剂是以银粉为导电填料以环氧树脂为粘合剂的体系。
The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed.
文中介绍了三种典型无铅焊料体系的不足之处，以及银导电胶研究中的三个难题。
The effects of silver particles morphologies and size on the electrical bulk resistivity of conductive adhesive were described.
从导电性角度考查银粉颗粒形貌和粒径大小对导电胶电阻率的影响。
So, the selection of the curing agent and the improvement of filler dispersion powder lay a foundation for the conductive adhesive.
因此，固化剂的选择和粉体填料分散性的改善为导电胶粘剂性能的研究奠定了基础。
The conductive adhesive is prepared by polymer matrix, barium titanate ceramic powder, diluent, curing agent and silane coupling agent.
本发明的导电胶由聚合物基体、钛酸钡陶瓷粉、稀释剂、固化剂和硅烷偶联剂制成。
Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers.
以改性树脂和混合树脂为粘料，铜粉为导电性填料，并配以适当添加剂、固化剂制备铜导电胶。
Heat ageing, natural ageing and water tolerance etc. tests are carried out to study and improve the ageing resistance of copper conductive adhesive.
将铜导电胶进行热老化、自然老化、耐水等试验，以研究其老化性能，并探求改善铜胶抗老化性能的途径。
In order to obtain better conductive functional filler and conductive adhesive, the surface of carbon nanotube (CNT) was wrapped by silver using chemical plating.
采用化学镀法在碳纳米管表面包覆金属银，从而获得了导电性极好的纳米银-碳复合管，并以该复合管为导电功能体制备导电胶。
On the other hand, the tenacity, conductivity and shear strength of conductive adhesive were enhanced by the incorporation of SiO2/Ag composites into conductive adhesive.
同时，在引入载银二氧化硅后，导电胶的韧性、导电性和剪切强度得到有效改善。
The invention solves the problems of the conductive adhesive with metal as the conductive filler, such as high preparation cost and large change of volume resistance after an aging test.
本发明解决了采用金属作为导电填料的导电胶制备成本高、老化试验后体积电阻变化大的问题。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
在集成电路封装工艺过程中，对导电胶进行无氧化加热固化的质量直接决定了集成电路的质量和使用寿命。
During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
在集成电路封装工艺过程中，对导电胶进行无氧化加热固化的质量直接决定了集成电路的质量和使用寿命。
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