Post-CMOS processes including electroless gold plating and special package technique are implemented to enhance the biocompatibility and stability of the biosensor.
在标准CMOS工艺基础上，应用无电浸镀金改进传感电极的生物兼容性，并采用特殊封装技术提高芯片在溶液环境中的稳定性。
Post-CMOS processes including electroless gold plating and special package technique are implemented to enhance the biocompatibility and stability of the biosensor.
在标准CMOS工艺基础上，应用无电浸镀金改进传感电极的生物兼容性，并采用特殊封装技术提高芯片在溶液环境中的稳定性。
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